MediaTek has achieved a significant feat by unveiling its first 3nm chipset, created through TSMC’s advanced 3nm process technology. This groundbreaking 3nm chipset is set to make its commercial debut in the coming year as a proud addition to the flagship Dimensity series. While the press release did not provide specific details about the new System-on-Chip (SoC), it highlighted the remarkable advancements offered by TSMC’s 3nm process, showcasing substantial improvements compared to the previous 5nm N5 process.
We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways. TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.
Joe Chen, President of MediaTek
TSMC’s cutting-edge 3nm process technology represents a significant leap in performance and efficiency. When compared to the previous 5nm process:
- The 3nm process demonstrates an impressive 18% increase in speed while maintaining the same power consumption.
- It achieves a remarkable 32% reduction in power consumption while delivering the same level of performance.
- Furthermore, it boasts a substantial 60% increase in logic density, indicating more compact and powerful chip designs.
MediaTek is poised to take advantage of these advancements by introducing its 3nm chips based on TSMC’s process technology. These chips will be available for a wide range of devices, including smartphones, tablets, intelligent cars, and more, starting in the second half of 2024.
